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GB/T 43863-2024 Large-scale Integrated circuits (LSI)-Package-Printed Circuit Board Common Design Structure 大规模集成电路（LSI）-封装-印制电路板共通设计结构 - 中英文版 |
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GB/T 43536.2-2023 Three-dimensional Integrated circuits Part 2: Calibration requirements for fine-pitch stacked chips 三维集成电路 第2部分：微间距叠层芯片的校准要求 - 中英文版 |
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GB/T 43536.1-2023 Three-dimensional Integrated circuits Part 1: Terms and definitions 三维集成电路 第1部分：术语和定义 - 中英文版 |
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GB/T 43227-2023 Test method for vapor-deposited protective films for inner leads of Integrated circuits for aerospace use 宇航用集成电路内引线气相沉积保护膜试验方法 - 中英文版 |
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GB/T 43226-2023 Single-event soft error time domain testing method for semiconductor Integrated circuits used in aerospace applications 宇航用半导体集成电路单粒子软错误时域测试方法 - 中英文版 |
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GB/T 43035-2023 Semiconductor Devices Integrated circuits Part 20: General Specifications for Film Integrated Circuits and Hybrid Film Integrated Circuits Part 1: Internal Visual Inspection Requirements 半导体器件 集成电路 第20部分：膜集成电路和混合膜集成电路总规范 第一篇：内部目检要求 - 中英文版 |
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GB/T 43034.3-2023 Integrated circuits - Measurement of pulse immunity - Part 3: Non-synchronous transient injection method 集成电路 脉冲抗扰度测量 第3部分：非同步瞬态注入法 - 中英文版 |
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GB/T 42968.8-2023 Integrated circuits - Electromagnetic immunity measurements - Part 8: Radiated immunity measurements - IC stripline method 集成电路 电磁抗扰度测量 第8部分：辐射抗扰度测量 IC带状线法 - 中英文版 |
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GB/T 42968.1-2023 Integrated circuits - Electromagnetic immunity measurements - Part 1: General conditions and definitions 集成电路 电磁抗扰度测量 第1部分：通用条件和定义 - 中英文版 |
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GB/T 20870.5-2023 Semiconductor devices Part 16-5: Microwave Integrated circuits Oscillators 半导体器件 第16-5部分：微波集成电路 振荡器 - 中英文版 |
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GB/T 20870.2-2023 Semiconductor devices Part 16-2: Microwave Integrated circuits Prescalers 半导体器件 第16-2部分：微波集成电路 预分频器 - 中英文版 |
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GB/T 42848-2023 Semiconductor Integrated circuits - Test methods for direct digital frequency synthesizers 半导体集成电路 直接数字频率合成器测试方法 - 中英文版 |
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GB/T 41325-2022 Low-density crystal primary pit silicon single crystal polishing wafer for Integrated circuits 集成电路用低密度晶体原生凹坑硅单晶抛光片 - 中英文版 |
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GB/T 7092-2021 Outline dimensions of semiconductor Integrated circuits 半导体集成电路外形尺寸 - 中英文版 |
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GB/T 37312.1-2019 Process management for avionics—Electronic components for aerospace, defence and high performance (ADHP) applications—Part 1: General requirements for high reliability Integrated circuits and discrete semiconductors 航空电子过程管理 航空航天、国防及其他高性能应用领域（ADHP）电子元器件 第1部分：高可靠集成电路与分立半导体器件通用要求 - 中英文版 |
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GB/T 11498-2018 Semiconductor devices—Integrated circuits—Part 21：Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures 半导体器件-集成电路-第21部分：膜集成电路和混合膜集成电路分规范(采用鉴定批准程序)半导体器件-集成电路-第21部分：膜集成电路和混合膜集成电路分规范(采用鉴定批准程序) - 中英文版 |
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GB/T 13062-2018 Semiconductor devices—Integrated circuits—Part 21-1:Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures 半导体器件-集成电路-第21-1部分：膜集成电路和混合膜集成电路空白详细规范(采用鉴定批准程序) - 中英文版 |
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GB/T 36479-2018 Integrated circuits—Test methods for column grid array 集成电路 焊柱阵列试验方法 - 中英文版 |
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GB/T 15879.5-2018 Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of Integrated circuits 半导体器件的机械标准化 第5部分：用于集成电路载带自动焊(TAB)的推荐值 - 中英文版 |
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GB/T 36614-2018 Integrated circuits—Memory devices pin configuration 集成电路 存储器引出端排列 - 中英文版 |
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GB/T 35007-2018 Semiconductor Integrated circuits—Measuring method of low voltage differential signaling circuitry 半导体集成电路 低电压差分信号电路测试方法 - 中英文版 |
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GB/T 35006-2018 Semiconductor Integrated circuits—Measuring method of level converter 半导体集成电路 电平转换器测试方法 - 中英文版 |
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GB/T 35004-2018 Logic digital Integrated circuits—Specification for I/O interface model for integrated circuit 数字集成电路 输入/输出电气接口模型规范 - 中英文版 |
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GB/T 35005-2018 Test methods for flip chip Integrated circuits 集成电路倒装焊试验方法 - 中英文版 |
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GB/T 14028-2018 Semiconductor Integrated circuits—Measuring method of analogue switch 半导体集成电路 模拟开关测试方法 - 中英文版 |
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GB/T 4377-2018 Semiconductor Integrated circuits—Measuring method of voltage regulators 半导体集成电路 电压调整器测试方法 - 中英文版 |
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GB/T 4023-2015 Semiconductor devices—Discrete devices and Integrated circuits— Part 2: Rectifier diodes 半导体器件 分立器件和集成电路 第2部分：整流二极管 - 中英文版 |
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GB/T 16525-2015 Semiconductor Integrated circuits—Specification of leadframes for plastic leaded chip carrier package 半导体集成电路 塑料有引线片式载体封装引线框架规范 - 中英文版 |
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GB/T 15878-2015 Semiconductor Integrated circuits—Specification of leadframes for small outline package 半导体集成电路 小外形封装引线框架规范 - 中英文版 |
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GB/T 15876-2015 Semiconductor Integrated circuits—Specification of leadframes for plastic quad flat package 半导体集成电路 塑料四面引线扁平封装引线框架规范 - 中英文版 |
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GB/T 14112-2015 Semiconductor Integrated circuits—Specification for stamped leadframes of plastic DIP 半导体集成电路 塑料双列封装冲制型引线框架规范 - 中英文版 |
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GB/T 15877-2013 Semiconductor Integrated circuits—Specification of DIP leadframes produced by etching 半导体集成电路 蚀刻型双列封装引线框架规范 - 中英文版 |
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GB/T 14620-2013 Alumina ceramic substrates for thin film Integrated circuits 薄膜集成电路用氧化铝陶瓷基片 - 中英文版 |
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GB/T 14619-2013 Alumina ceramic substrates for thick film Integrated circuits 厚膜集成电路用氧化铝陶瓷基片 - 中英文版 |
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GB 50809-2012 Code for design of silicon Integrated circuits wafer fab 硅集成电路芯片工厂设计规范 - 中英文版 |
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GB/T 15157.12-2011 Connectors for frequencies below 3 MHz for use with printed boards - Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with Integrated circuits 频率低于3MHz的印制板连接器 第12部分：集成电路插座的尺寸、一般要求和试验方法详细规范 - 中英文版 |
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GB/T 20870.1-2007 Semiconductor devices - Part 16-1: Microwave Integrated circuits - Amplifiers 半导体器件 第16-1部分：微波集成电路 放大器 - 中英文版 |
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GB/T 17574.9-2006 Semiconductor devices - Integrated circuits - Part 2-9: Digital integrated circuits - Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories 半导体器件 集成电路 第2-9部分：数字集成电路 紫外光擦除电可编程MOS只读存储器空白详细规范 - 中英文版 |
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GB/T 17574.20-2006 Semiconductor devices - Integrated circuits - Part 2-20：Digital integrated circuits - Family specification - Low voltage integrated circuits 半导体器件 集成电路 第2-20部分：数字集成电路 低压集成电路族规范 - 中英文版 |
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GB/T 17574.11-2006 Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit electrically erasable and programmable read-only memory 半导体器件 集成电路 第2-11部分：数字集成电路 单电源集成电路电可擦可编程只读存储器 空白详细规范 - 中英文版 |
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GB/T 4589.1-2006 Semiconductor devices - Part 10: Generic specification for discrete devices and Integrated circuits 半导体器件 第10部分：分立器件和集成电路总规范 - 中英文版 |
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GB/T 20515-2006 Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits 半导体器件 集成电路 第5部分：半定制集成电路 - 中英文版 |
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GB/T 12750-2006 Semiconductor devices―Integrated circuits―Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits 半导体器件 集成电路 第11部分：半导体集成电路分规范(不包括混合电路) - 中英文版 |
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GB/T 2900.66-2004 Electrotechnical terminology--Semiconductor devices and Integrated circuits 电工术语 半导体器件和集成电路 - 中英文版 |
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GB/T 19403.1-2003 Semiconductor devices--Integrated circuits--Part 11:Section 1:Internal visual examination for semiconductor integrated circuits(excluding hybrid circuits) 半导体器件 集成电路 第11部分:第1篇:半导体集成电路 内部目检 (不包括混合电路) - 中英文版 |
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GB/T 17574.10-2003 Semiconductor devices--Integrated circuits--Part 2-10:Digital integrated circuits--Blank detail specification for integrated circuit dynamicread/write memories 半导体器件 集成电路 第2-10部分:数字集成电路 集成电路动态读/写存储器空白详细规范 - 中英文版 |
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GB/T 15651.3-2003 Discrete semiconductor devices and Integrated circuits--Part 5-3:Optoelectronic devices--Measuring methods 半导体分立器件和集成电路 第5-3部分:光电子器件 测试方法 - 中英文版 |
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GB/T 15651.2-2003 Discrete semiconductor devices and Integrated circuits--Part 5-2:Optoelectronic devices--Essential ratings and characteristics 半导体分立器件和集成电路 第5-2部分:光电子器件 基本额定值和特性 - 中英文版 |
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GB/T 18500.2-2001 Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 2:Blank detail specification for linear analogue-to-digital converters(ADC) 半导体器件 集成电路 第4部分:接口集成电路 第二篇:线性模拟/数字转换器(ADC)空白详细规范 - 中英文版 |
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GB/T 18500.1-2001 Semiconductor devices--Integrated circuits--Part 4:Interface integrated circuits--Section 1:Blank detail specification for linear digital-to-analogue converters(DAC) 半导体器件 集成电路 第4部分:接口集成电路 第一篇:线性数字/模拟转换器(DAC)空白详细规范 - 中英文版 |
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