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GB/T 15879.604-2023 Mechanical standardization of semiconductor devices - Part 6-4: General rules for drawing outline drawings of surface mount semiconductor device packages - Dimensional measurement methods for ball array (BGA) packages 半导体器件的机械标准化 第6-4部分：表面安装半导体器件封装外形图绘制的一般规则 焊球阵列（BGA）封装的尺寸测量方法 - 中英文版 |
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GB/T 19334-2021 Dimensions of low-voltage switchgear and controlgear—Standardized mounting on rails for mechanical support of switchgear,controlgear and accessories 低压开关设备和控制设备的尺寸 在开关设备和控制设备及其附件中作机械支承的标准安装轨 - 中英文版 |
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GB/T 15879.4-2019 Mechanical standardization of semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages 半导体器件的机械标准化 第4部分：半导体器件封装外形的分类和编码体系 - 中英文版 |
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GB/T 15879.5-2018 Mechanical standardization of semiconductor devices—Part 5: Recommendations applying to tape automated bonding(TAB) of integrated circuits 半导体器件的机械标准化 第5部分：用于集成电路载带自动焊(TAB)的推荐值 - 中英文版 |
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GB/T 16608.51-2012 Electromechanical all-or-nothing relays - Part 51: Blank detail specification - Electromechanical all-or-nothing telecom relays of assessed quality - Non-standardized types and construction 有或无机电继电器 第51部分：空白详细规范 电信用有质量评定的有或无机电继电器 非标准类型和结构 - 中英文版 |
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GB/T 19334-2003 Dimension of low-voltage switchgear and controlgear--Standardized mounting on rails for mechanical support of electrical devices in switchgear andcontrolgear installations 低压开关设备和控制设备的尺寸 在成套开关设备和控制设备中作电器机械支承的标准安装轨 - 中英文版 |
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GB/T 15879-1995 Mechanical standardization of semiconductor devices--Part 5:Recommendations applying to tape automated bonding (TAB) of integrated circuits 半导体器件的机械标准化 第5部分:用于集成电路载带自动焊(TAB)的推荐值 - 中英文版 |
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