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GB/T 43723-2024 Performance Requirements for semi-integrated LED lamps with a power supply voltage not greater than 50V AC effective value or 120V DC without ripple for general lighting 普通照明用电源电压不大于交流有效值50V或无纹波直流120V的半集成式LED灯-性能要求 - 中英文版 |
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GB/T 19633.2-2024 Terminally sterilized medical device packaging - Part 2: Requirements for confirmation of molding, sealing and assembly processes 最终灭菌医疗器械包装-第2部分：成型、密封和装配过程的确认的要求 - 中英文版 |
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GB/T 15651.7-2024 Printed board assembly - Part 6: Evaluation requirements for voids in ball grid array (BGA) and land grid array (LGA) solder joints and test methods 半导体器件-第5-7部分：光电子器件-光电二极管和光电晶体管 - 中英文版 |
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GB/T 39075.201-2023 Organic light-emitting diode (OLED) light sources for general lighting Safety Part 2-1: Special requirements Semi-integrated OLED modules 普通照明用有机发光二极管（OLED）光源 安全 第2-1部分：特殊要求 半集成式OLED模块 - 中英文版 |
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GB/T 32800.6-2023 Hand-held non-electric power tools Safety requirements Part 6: Assembly power tools for threaded fasteners 手持式非电类动力工具 安全要求 第6部分：螺纹紧固件用装配动力工具 - 中英文版 |
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GB/T 43127-2023 General requirements for structural components and assemblies of aerospace products 航天产品结构部件与组件通用要求 - 中英文版 |
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GB/T 43059-2023 Flatness control requirements for printed boards and printed board assemblies 印制板及印制板组装件的平整度控制要求 - 中英文版 |
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GB/T 43035-2023 Semiconductor Devices Integrated Circuits Part 20: General Specifications for Film Integrated Circuits and Hybrid Film Integrated Circuits Part 1: Internal Visual Inspection Requirements 半导体器件 集成电路 第20部分：膜集成电路和混合膜集成电路总规范 第一篇：内部目检要求 - 中英文版 |
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GB/T 43021-2023 Rework, modification and rework process requirements for electronic assembly welding 电子组装件焊接的返工、改装和返修工艺要求 - 中英文版 |
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GB/T 32800.1-2023 Hand-held non-electric power tools—Safety requirements—Part 1: Assembly power tools for non-threaded structural fasteners 手持式非电类动力工具 安全要求 第1部分：非螺纹结构紧固件用装配动力工具 - 中英文版 |
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GB/T 42125.14-2023 Safety requirements for electrical equipment for measurement, control and laboratory use - Part 14: Particular requirements for automatic and semi-automatic laboratory equipment for analysis and other purposes 测量、控制和实验室用电气设备的安全要求 第14部分：实验室用分析和其他目的自动和半自动设备的特殊要求 - 中英文版 |
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GB/T 41040-2021 COTS semiconductor parts for space application -- Quality assurance requirements 宇航用商业现货（COTS）半导体器件 质量保证要求 - 中英文版 |
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GB/T 39037.1-2021 Lashing and securing arrangements on road vehicles for sea transportation on Ro/Ro ships—General requirements—Part 1：Commercial vehicles and combinations of vehicles，semi-trailers excluded 用于海上滚装船运输的道路车辆的系固点与系固设施布置 通用要求 第1部分：商用车和汽车列车（不包括半挂车） - 中英文版 |
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GB/T 39019-2020 Custom furniture—Technical requirements for composite assembly identification 定制家具 组合组装标识技术要求 - 中英文版 |
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GB/T 39037.2-2020 Lashing and securing arrangements on road vehicles for sea transportation on Ro/Ro ships—General requirements—Part 2: Semi-trailers 用于海上滚装船运输的道路车辆的系固点与系固设施布置 通用要求 第2部分：半挂车 - 中英文版 |
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GB 9706.228-2020 Medical electrical equipment—Part 2-28: Particular requirements for the basic safety and essential performance of X-ray tube assemblies for medical diagnosis 医用电气设备 第2-28部分：医用诊断X射线管组件的基本安全和基本性能专用要求 - 中英文版 |
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GB/T 39515.4-2020 Agricultural and forestry machinery—Environmental requirements for sprayers—Part 4: Fixed and semi-mobile sprayers 农林机械 喷雾机的环境要求 第4部分：固定式和半移动式喷雾机 - 中英文版 |
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GB/T 7251.8-2020 Low-voltage switchgear and controlgear assemblies—Part 8: General technical requirements for intelligent assembly 低压成套开关设备和控制设备 第8部分：智能型成套设备通用技术要求 - 中英文版 |
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GB/T 38345-2019 General design requirements of semiconductor integrate circuit for space application 宇航用半导体集成电路通用设计要求 - 中英文版 |
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GB/T 38023-2019 Finishing requirements for parts and assemblies of the mechanical watch movements 机械手表机心零部件的精饰要求 - 中英文版 |
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GB/T 37499-2019 Safety and control devices for gas burners and gas-burning appliances—Particular requirements—Automatic and semi-automatic valves 燃气燃烧器和燃烧器具用安全和控制装置 特殊要求 自动和半自动阀 - 中英文版 |
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GB/T 37312.1-2019 Process management for avionics—Electronic components for aerospace, defence and high performance (ADHP) applications—Part 1: General requirements for high reliability integrated circuits and discrete semiconductors 航空电子过程管理 航空航天、国防及其他高性能应用领域（ADHP）电子元器件 第1部分：高可靠集成电路与分立半导体器件通用要求 - 中英文版 |
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GB/T 36140-2018 Technical requirements for assembled insulation combination wall composite by glass fiber reinforced inorganic materials 装配式玻纤增强无机材料复合保温墙体技术要求 - 中英文版 |
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GB/T 35010.6-2018 Semiconductor die products—Part 6: Requirements for concerning thermal simulation 半导体芯片产品 第6部分：热仿真要求 - 中英文版 |
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GB/T 35010.5-2018 Semiconductor die products—Part 5：Requirements for concerning electrical simulation 半导体芯片产品 第5部分：电学仿真要求 - 中英文版 |
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GB/T 35010.1-2018 Semiconductor die products—Part 1：Requirements for procurement and use 半导体芯片产品 第1部分：采购和使用要求 - 中英文版 |
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GB/T 35010.4-2018 Semiconductor die products—Part 4: Requirements for die users and suppliers 半导体芯片产品 第4部分：芯片使用者和供应商要求 - 中英文版 |
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GB/T 7251.4-2017 Low-voltage switchgear and controlgear assemblies—Part 4: Particular requirements for assemblies for construction sites (ACS) 低压成套开关设备和控制设备 第4部分：对建筑工地用成套设备（ACS）的特殊要求 - 中英文版 |
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GB/T 5226.33-2017 Electrical safety of machinary—Electrical equipment of machines—Part 33: Requirements for semiconductor fabrication equipment 机械电气安全 机械电气设备 第33部分：半导体设备技术条件 - 中英文版 |
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GB/T 33628-2017 Wind turbine generator systems—Assembly requirements for high-strength-bolted joint 风力发电机组 高强螺纹连接副安装技术要求 - 中英文版 |
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GB/T 33631-2017 General requirements for inlet and exhaust system of aero-derivative gas turbine assembly 航空派生型燃气轮机成套设备进排气系统通用技术要求 - 中英文版 |
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GB/T 33632-2017 General installation requirements for aero-derivative gas turbine assembly 航空派生型燃气轮机成套设备安装通用技术要求 - 中英文版 |
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GB/T 33641.3-2017 Tractors and machinery for agriculture and forestry—Seat belts—Part 3：Requirements for assemblies 农林拖拉机和机械 安全带 第3部分：总成要求 - 中英文版 |
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GB/T 13539.4-2016 Low-voltage fuses—Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices 低压熔断器 第4部分：半导体设备保护用熔断体的补充要求 - 中英文版 |
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GB/T 32442-2015 Assembly technical requirements for knock-down furniture 可拆装家具拆装技术要求 - 中英文版 |
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GB/T 19633.2-2015 Packaging for terminally sterilized medical devices—Part 2: Validation requirements for forming, sealing and assembly processes 最终灭菌医疗器械包装 第2部分：成形、密封和装配过程的确认的要求 - 中英文版 |
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GB/T 32076.1-2015 High-strength structural bolting assemblies for preloading—Part 1: General requirements 预载荷高强度栓接结构连接副 第1部分：通用要求 - 中英文版 |
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GB/T 31970-2015 Performance requirements and bench test methods for air brake caliper assemble of automobile 汽车用气压制动卡钳总成性能要求及台架试验方法 - 中英文版 |
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GB/T 31476-2015 Requirements for solders for high-quality interconnections in electronics assembly 电子装联高质量内部互连用焊料 - 中英文版 |
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GB/T 31475-2015 Requirements for solder paste for high-quality interconnections in electronics assembly 电子装联高质量内部互连用焊锡膏 - 中英文版 |
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GB/T 31377-2015 Requirements of disassembly and treatment for waste electrical and electronic product—CRT televisions and display devices 废弃电子电气产品拆解处理要求 阴极射线管电视机及显示设备 - 中英文版 |
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GB/T 31376-2015 Requirements of disassembly and treatment for waste electrical and electronic product—LCD televisions and display devices 废弃电子电气产品拆解处理要求 液晶电视机及显示设备 - 中英文版 |
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GB/T 31375-2015 Requirements of disassembly and treatment for waste electrical and electronic product—PDP televisions and display devices 废弃电子电气产品拆解处理要求 等离子电视机及显示设备 - 中英文版 |
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GB/T 31374-2015 Requirements of disassembly and treatment for waste electrical and electronic product—Copier 废弃电子电气产品拆解处理要求 复印机 - 中英文版 |
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GB/T 31373-2015 Requirements of disassembly and treatment for waste electrical and electronic product—Printer 废弃电子电气产品拆解处理要求 打印机 - 中英文版 |
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GB/T 31372-2015 Requirements of disassembly and treatment for waste electrical and electronic product—Portable microcomputer 废弃电子电气产品拆解处理要求 便携式微型计算机 - 中英文版 |
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GB/T 31371-2015 Requirements of disassembly and treatment for waste electrical and electronic product—Desktop microcomputer 废弃电子电气产品拆解处理要求 台式微型计算机 - 中英文版 |
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GB/T 20641-2014 Empty enclosures for Low-voltage switchgear and controlgear assemblies―General requirements 低压成套开关设备和控制设备 空壳体的一般要求 - 中英文版 |
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GB 4793.9-2013 Safety requirements for electrical equipment for measurement, control and laboratory use―Part 9: Particular requirements for automatic and semi-automatic laboratory equipment for analysis and other purposes 测量、控制和实验室用电气设备的安全要求 第9部分：实验室用分析和其他目的自动和半自动设备的特殊要求 - 中英文版 |
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GB/T 30116-2013 Requirements for semiconductor manufacturing facility electromagnetic compatibility 半导体生产设施电磁兼容性要求 - 中英文版 |
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