China Testing of semicondu GB Standards Search Result |
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GB/T 43493.3-2023 Semiconductor devices - Non-destructive testing and identification criteria for defects in silicon carbide homoepitaxial wafers for power devices - Part 3: Photoluminescence detection method of defects 半导体器件 功率器件用碳化硅同质外延片缺陷的无损检测识别判据 第3部分：缺陷的光致发光检测方法 - 中英文版 |
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GB/T 43226-2023 Single-event soft error time domain testing method for semiconductor integrated circuits used in aerospace applications 宇航用半导体集成电路单粒子软错误时域测试方法 - 中英文版 |
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GB/T 42676-2023 Testing the quality of semiconductor single crystals X-ray diffraction method 半导体单晶晶体质量的测试 X射线衍射法 - 中英文版 |
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GB/T 6616-2023 Testing of semiconductor wafer resistivity and semiconductor film sheet resistance non-contact eddy current method 半导体晶片电阻率及半导体薄膜薄层电阻的测试 非接触涡流法 - 中英文版 |
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GB/T 4937.30-2018 Semiconductor devices—Mechanical and climatic test methods—Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing 半导体器件 机械和气候试验方法 第30部分：非密封表面安装器件在可靠性试验前的预处理 - 中英文版 |
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GB/T 1555-2009 Testing methods for determining the orientation of a semiconductor single crystal 半导体单晶晶向测定方法 - 中英文版 |
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