Semiconductor device standards english version

NATIONAL STANDARD OF THE PEOPLE'S REPUBLIC OF CHINA

GB/T 41852-2022

Semiconductor devices; microelectromechanical devices; bending and shearing test methods for bonding strength of MEMS structures

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The Standardization Administration of the People's Republic of China

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GB Standard Code	GB/T 41852-2022
Standard Category	China National Standards
GB Standard English Title	Semiconductor devices; microelectromechanical devices; bending and shearing test methods for bonding strength of MEMS structures
GB Standard Chinese Title	半导体器件微机电器件 MEMS结构黏结强度的弯曲和剪切试验方法
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