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GB/T 11498-2018 Semiconductor devices—Integrated circuits—Part 21：Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures 半导体器件-集成电路-第21部分：膜集成电路和混合膜集成电路分规范(采用鉴定批准程序)半导体器件-集成电路-第21部分：膜集成电路和混合膜集成电路分规范(采用鉴定批准程序) - 英文版 |
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GB/T 13062-2018 Semiconductor devices—Integrated circuits—Part 21-1:Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the qualification approval procedures 半导体器件-集成电路-第21-1部分：膜集成电路和混合膜集成电路空白详细规范(采用鉴定批准程序) - 英文版 |
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GB/T 36479-2018 Integrated circuits—Test methods for column grid array 集成电路 焊柱阵列试验方法 - 英文版 |
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GB/T 36614-2018 Integrated circuits—Memory devices pin configuration 集成电路 存储器引出端排列 - 英文版 |
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GB/T 35007-2018 Semiconductor Integrated circuits—Measuring method of low voltage differential signaling circuitry 半导体集成电路 低电压差分信号电路测试方法 - 英文版 |
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GB/T 35006-2018 Semiconductor Integrated circuits—Measuring method of level converter 半导体集成电路 电平转换器测试方法 - 英文版 |
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GB/T 35004-2018 Logic digital Integrated circuits—Specification for I/O interface model for integrated circuit 数字集成电路 输入/输出电气接口模型规范 - 英文版 |
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GB/T 14028-2018 Semiconductor Integrated circuits—Measuring method of analogue switch 半导体集成电路 模拟开关测试方法 - 英文版 |
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GB/T 4377-2018 Semiconductor Integrated circuits—Measuring method of voltage regulators 半导体集成电路 电压调整器测试方法 - 英文版 |
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GB/T 4023-2015 Semiconductor devices—Discrete devices and Integrated circuits— Part 2: Rectifier diodes 半导体器件 分立器件和集成电路 第2部分：整流二极管 - 英文版 |
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GB/T 16525-2015 Semiconductor Integrated circuits—Specification of leadframes for plastic leaded chip carrier package 半导体集成电路 塑料有引线片式载体封装引线框架规范 - 英文版 |
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GB/T 15878-2015 Semiconductor Integrated circuits—Specification of leadframes for small outline package 半导体集成电路 小外形封装引线框架规范 - 英文版 |
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GB/T 15876-2015 Semiconductor Integrated circuits—Specification of leadframes for plastic quad flat package 半导体集成电路 塑料四面引线扁平封装引线框架规范 - 英文版 |
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GB/T 14112-2015 Semiconductor Integrated circuits—Specification for stamped leadframes of plastic DIP 半导体集成电路 塑料双列封装冲制型引线框架规范 - 英文版 |
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GB/T 15877-2013 Semiconductor Integrated circuits—Specification of DIP leadframes produced by etching 半导体集成电路 蚀刻型双列封装引线框架规范 - 英文版 |
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