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GB/T 15879.604-2023 Mechanical standardization of semiconductor devices - Part 6-4: General rules for drawing outline drawings of surface mount semiconductor device packages - Dimensional measurement methods for ball array (BGA) packages 半导体器件的机械标准化 第6-4部分:表面安装半导体器件封装外形图绘制的一般规则 焊球阵列(BGA)封装的尺寸测量方法 - 英文版 |
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GB/T 7092-2021 Outline dimensions of semiconductor integrated circuits 半导体集成电路外形尺寸 - 英文版 |
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GB/T 14006.3-1997 Outline dimensions of transformers and inductors for use in telecommunication and electronic equipment--Part 3:Transformers and inductors using YUI-1 laminations 通信和电子设备用变压器和电感器外形尺寸 第3部分:使用YUI-1系列铁心片的变压器和电感器 - 英文版 |
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GB/T 7092-1993 Outline dimensions of semiconductor integratedcircuits 半导体集成电路外形尺寸 - 英文版 |
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GB/T 14006-1992 Outline dimensions of transformers and inductors for use in telecommunication and electronic equipment--Part 1:Transformers and inductors using YEI-1 laminations 通信和电子设备用变压器和电感器外形尺寸 第一部分:采用 YEI-1铁心片的变压器和电感器 - 英文版 |
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GB/T 13583-1992 Outline dimension series of infrared detectors 红外探测器外形尺寸系列 - 英文版 |
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GB/T 7581-1987 Dimensions of outlines for semiconductor discrete devices 半导体分立器件外形尺寸 - 英文版 |
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