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GB/T 15879.604-2023
Mechanical standardization of semiconductor devices - Part 6-4: General rules for drawing outline drawings of surface mount semiconductor device packages - Dimensional measurement methods for ball array (BGA) packages
半导体器件的机械标准化 第6-4部分:表面安装半导体器件封装外形图绘制的一般规则 焊球阵列(BGA)封装的尺寸测量方法 - 英文版
GB/T 7092-2021
Outline dimensions of semiconductor integrated circuits
半导体集成电路外形尺寸 - 英文版
GB/T 14006.3-1997
Outline dimensions of transformers and inductors for use in telecommunication and electronic equipment--Part 3:Transformers and inductors using YUI-1 laminations
通信和电子设备用变压器和电感器外形尺寸 第3部分:使用YUI-1系列铁心片的变压器和电感器 - 英文版
GB/T 7092-1993
Outline dimensions of semiconductor integratedcircuits
半导体集成电路外形尺寸 - 英文版
GB/T 14006-1992
Outline dimensions of transformers and inductors for use in telecommunication and electronic equipment--Part 1:Transformers and inductors using YEI-1 laminations
通信和电子设备用变压器和电感器外形尺寸 第一部分:采用 YEI-1铁心片的变压器和电感器 - 英文版
GB/T 13583-1992
Outline dimension series of infrared detectors
红外探测器外形尺寸系列 - 英文版
GB/T 7581-1987
Dimensions of outlines for semiconductor discrete devices
半导体分立器件外形尺寸 - 英文版

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