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GB/T 35010.6-2018 Semiconductor die products—Part 6: Requirements for concerning thermal simulation 半导体芯片产品 第6部分:热仿真要求 - 英文版 |
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GB/T 35010.5-2018 Semiconductor die products—Part 5:Requirements for concerning electrical simulation 半导体芯片产品 第5部分:电学仿真要求 - 英文版 |
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GB/T 26852-2011 Requirements concerning the interoperability between electromechanical and electrical applications in CAx-systems CAx系统中机电和电气应用之间的互操作要求 - 英文版 |
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